Cabinet Clears Rs 4,600 Crore Semiconductor Projects in Odisha, Punjab, and Andhra Pradesh

The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects worth Rs 4,600 crore under the India Semiconductor Mission (ISM). This development raises the total number of sanctioned semiconductor projects to ten, with combined investments of about Rs 1.60 lakh crore across six states.

The newly approved projects are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. They will set up facilities in Odisha, Punjab, and Andhra Pradesh, aiming to meet the rising demand from telecom, automotive, data centres, consumer electronics, and industrial sectors.

Key projects include:

• SiCSem Private Limited in collaboration with Clas-SiC Wafer Fab Ltd. (UK) will build India’s first commercial Silicon Carbide (SiC) compound semiconductor fabrication unit in Bhubaneswar, Odisha. It will have an annual capacity of 60,000 wafers and 96 million packaging units for applications in defence, electric vehicles, railways, data centres, consumer appliances, and solar inverters.

• 3D Glass Solutions Inc. will establish an advanced packaging and embedded glass substrate unit in Bhubaneswar, featuring 3D heterogeneous integration technology. It will have an annual capacity of 69,600 glass panel substrates and 50 million assembled units, catering to defence, AI, high-performance computing, automotive, and photonics.

• ASIP Technologies, in partnership with APACT Co. Ltd. from South Korea, will set up a plant in Andhra Pradesh with an annual output of 96 million units for mobile devices, set-top boxes, automotive electronics, and other consumer products.

• Continental Device India Private Limited (CDIL) will expand its semiconductor manufacturing facility in Mohali, Punjab, to produce 158 million units annually. The expansion will focus on high-power devices such as MOSFETs, IGBTs, Schottky diodes, and transistors for EVs, renewable energy, power conversion, and communications.

These projects are expected to directly create over 2,000 skilled jobs and many more indirect employment opportunities. They align with India’s strategy to strengthen its semiconductor manufacturing base, complementing the government’s ongoing support for chip design, R&D, and talent development programs that have already engaged over 278 academic institutions and 72 startups, and trained more than 60,000 students for industry needs.